A Novel Single-Layer High-Temperature-Resistant Adhesive Layer Applied in Advanced Wafer-Level Packaging-Reference-Cited by-同舟云学术

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A Novel Single-Layer High-Temperature-Resistant Adhesive Layer Applied in Advanced Wafer-Level Packaging

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Dai Wenxue¹,Liu Qiang¹,Li Zhipeng¹,Li Kang¹,Wang Xuefan¹,Wang Fangcheng¹,Li Jinhui¹,Sun Rong¹,Zhang Guoping¹

Affiliation:

1. Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials Shenzhen Institute of Advanced Technology,Shenzhen,China,518055

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873336.pdf?arnumber=9873336

Reference6 articles.

1. Soluble and colorless polyimides with polyalicyclic structure;toshihiko;Reactive Polymers,1996

2. Study of Bondable Laser Release Material Using 355 nm Energy to Facilitate RDL-First and Die-First Fan-Out Wafer-Level Packaging (FOWLP)

3. Optimization for temporary bonding process in PECVD passivated micro-bumping technology

4. Characterization of polysiloxane-block-polyimides with silicate group in the polysiloxane segments;nobuyuki;Polymer,1999

5. A Single-Layer Mechanical Debonding Adhesive for Advanced Wafer-Level Packaging

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications;Electronics;2023-03-31

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