Author:
Wen Shengmin,Goodelle Jason,Moua VanDee,Huang Kenny,Xiao Chris
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Micro-Cantilever Array With Electroplating Tin Bumps for Flip-Chip Bonding Technology;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-12
2. RF Performances and De-Embedding Techniques of Passive Devices in 3D Homogeneous Integration at Sub-THz;2023 53rd European Microwave Conference (EuMC);2023-09-19
3. Multi-Package Co-Design for Chiplet Integration;Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design;2022-10-30