1. Integrated Design Ecosystem for Chiplets Heterogeneous Integration and Chip-to-Chip Interconnects in Advanced Packaging Technology;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. RONet: Scaling GPU System with Silicon Photonic Chiplet;2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD);2023-10-28
3. Temperature Estimation of HBM2 Channels with Tail Distribution of Retention Errors in FPGA-HBM2 Platform;Electronics;2022-12-22
4. Adaptive Patterning and M‐Series for High Density Integration;Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces;2021-12-03
5. Pathfinding for 2.5D interconnect technologies;Proceedings of the Workshop on System-Level Interconnect: Problems and Pathfinding Workshop;2020-11-05