Pathfinding for 2.5D interconnect technologies-Reference-Cited by-同舟云学术

Pathfinding for 2.5D interconnect technologies

Published:2020-11-05 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the Workshop on System-Level Interconnect: Problems and Pathfinding Workshop
language:
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Author:

Pal Saptadeep¹,Gupta Puneet¹

Affiliation:

1. University of California, Los Angeles

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3414622.3431906

Reference34 articles.

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2. 2020. 2.5D Interposer(I-Cube™) Development. samsungfoundry.com. 2020. 2.5D Interposer(I-Cube ™ ) Development. samsungfoundry.com.

3. 2020. HSPICE. online. https://www.synopsys.com/verification/ams-verification/hspice.html 2020. HSPICE. online. https://www.synopsys.com/verification/ams-verification/hspice.html

4. ESD failure modes: characteristics mechanisms, and process influences

5. ESD Association et al. 2007. ESD Association Standard for the Development of an Electrostatic Discharge Control Program for-Protection of Electrical and Electronic Parts Assemblies and Equipment (excluding Electrically Initiated Explosive Devices). ANSI/ESD S20: 20-2007. (2007). ESD Association et al. 2007. ESD Association Standard for the Development of an Electrostatic Discharge Control Program for-Protection of Electrical and Electronic Parts Assemblies and Equipment (excluding Electrically Initiated Explosive Devices). ANSI/ESD S20: 20-2007. (2007).

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