Integrated Design Ecosystem for Chiplets Heterogeneous Integration and Chip-to-Chip Interconnects in Advanced Packaging Technology
Author:
Affiliation:
1. Advanced Semiconductor Engineering, Inc. (US),Engineering & Technical Promotion,Austin,US
2. Advanced Semiconductor Engineering, Inc,Corporate R&D Center,Kaohsiung,Taiwan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10564841/10564831/10564890.pdf?arnumber=10564890
Reference8 articles.
1. Chiplet Heterogeneous Integration Technology—Status and Challenges
2. State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid Bonding
3. 3D Multi-chip Integration with System on Integrated Chips (SoIC™)
4. Advanced HDFO Packaging Solutions for Chiplets Integration in HPC Application;Cao
5. SLIMTM Advanced Fan-out Packaging for High Performance Multi-die Solutions;Hinter
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