State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid Bonding-Reference-Cited by-同舟云学术

State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid Bonding

Published:2021-10-01 Issue:4 Volume:18 Page:145-160
ISSN:1551-4897
Container-title:Journal of Microelectronics and Electronic Packaging
language:en
Short-container-title:

Author:

Lau John H

Abstract

Abstract In this study, the recent advances and trends of chip-let design and heterogeneous integration packaging will be investigated. Emphasis is placed on the definition, kinds, advantages and disadvantages, lateral interconnects, and examples of chiplet design and heterogeneous integration packaging. Also, emphasis is placed on the fundamental and examples of hybrid bonding.

Publisher

IMAPS - International Microelectronics Assembly and Packaging Society

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,Electronic, Optical and Magnetic Materials

Link

https://meridian.allenpress.com/jmep/article-pdf/18/4/145/2996507/i1551-4897-18-4-145.pdf

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