Development of Photosensitive Polyimides Compositions with Low Dielectric Property Corresponding to Semiconductor Back-End Processes
Author:
Affiliation:
1. Research & Development H.Q., ARAKAWA CHEMICAL, INDUSTRIES, LTD.
2. Fine chemicals & Electronics Div., Business H.Q., ARAKAWA CHEMICAL INDUSTRIES, LTD.
Publisher
Japan Institute of Electronics Packaging
Link
https://www.jstage.jst.go.jp/article/jiep/27/5/27_426/_pdf
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3. 3) J. H. Lau: "State-of-the-art and outlooks of chiplets heterogeneous integration and hybrid bonding," Journal of Microelectronics and Electronic Packaging, Vol. 18, Issue 4, pp. 145–160, 2021
4. 4) P. Wesling: Heterogeneous Integration Roadmap 2019 Edition, Chapter 23: Wafer-Level Packaging (WLP), https://eps.ieee.org/images/files/HIR_2019/HIR1_ch23_WLP.pDf
5. 5) P. Wesling: Heterogeneous Integration Roadmap 2021 Edition, Chapter 23: Wafer-Level Packaging (WLP), https://eps.ieee.org/images/files/HIR_2021/ch23-wlpfinal2.pDf
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