SoIC_H Technology for Heterogeneous System Integration-Reference-Cited by-同舟云学术

SoIC_H Technology for Heterogeneous System Integration

Published:2022-12 Issue:12 Volume:69 Page:7167-7172
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Yu Douglas C. H.¹,Wang Chuei-Tang¹,Lin Chia-Chia¹^ORCID,Lu Chih-Hsin¹,Wu Gene¹,Huang Chien-Yuan¹,Chen Wei-Ting¹,Ku Terry¹,Yee Kuo-Chung¹,Tsai Chung-Hao¹^ORCID

Affiliation:

1. Pathfinding for the System Integration, Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/16/9967813/09904740.pdf?arnumber=9904740

Reference14 articles.

1. 10 and 7 μm Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process

2. Next-Generation Design and Technology Co-optimization (DTCO) of System on Integrated Chip (SoIC) for Mobile and HPC Applications

3. Cost-effective design of scalable high-performance systems using active and passive interposers

4. DESTINY: A Comprehensive Tool with 3D and Multi-Level Cell Memory Modeling Capability

5. Low Temperature SoIC™ Bonding and Stacking Technology for 12/16-Hi High Bandwidth Memory (HBM)

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