Overview and development trends in the field of MEMS packaging-Reference-Cited by-同舟云学术

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Overview and development trends in the field of MEMS packaging

Published:2001 Issue: Volume: Page:
ISSN:
Container-title:Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)
language:
Short-container-title:

Author:

Reichl H.¹,Grosser V.

Affiliation:

1. Fraunhofer-Inst. fur Zuverlassigkeit und Mikrointegration, Berlin, Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/7264/19601/00906464.pdf?arnumber=906464

Cited by 33 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design and Fabrication of a Wafer-level Interposer for System-on-Wafer Packaging Application;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

2. Electroplated Al Press Marking for Wafer-Level Bonding;Micromachines;2022-07-30

3. A highly stable, nanotube-enhanced, CMOS-MEMS thermal emitter for mid-IR gas sensing;Scientific Reports;2021-11-25

4. Low-temperature hermetic thermo-compression bonding using electroplated copper sealing frame planarized by fly-cutting for wafer-level MEMS packaging;Sensors and Actuators A: Physical;2018-08

5. 3D Monolithic Metal Orifice Plate for SERS Application: A Showcase of Low Cost MEMS Packaging;2017 IEEE 67th Electronic Components and Technology Conference (ECTC);2017-05

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