The Accelerated Testing of Plastic Encapsulated Semiconductor Components
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/4207988/4207989/04208031.pdf?arnumber=4208031
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Influence of bias humidity testing and application on time-dependent, Arrhenius-law-based stability predictions for thin film resistors;Microelectronics Reliability;2014-06
2. Accelerated Life Testing in Epoxy Packaged High Luminosity Light Emitting Diodes;Journal of Electronic Packaging;2011-09-01
3. Strength Evaluation of Conductive Adhesive Paste for Die Bonding During Reflow Soldering;TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A;2010
4. Evaluation of AlGaInP LEDs reliability based on accelerated tests;Microelectronics Reliability;2009-09
5. Design for Microelectronics Reliability;Wiley Encyclopedia of Electrical and Electronics Engineering;1999-12-27
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