Breakdown and Healing of Tungsten-Oxide Films on Microelectromechanical Relay Contacts-Reference-Cited by-同舟云学术

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Breakdown and Healing of Tungsten-Oxide Films on Microelectromechanical Relay Contacts

Published:2022-04 Issue:2 Volume:31 Page:265-274
ISSN:1057-7157
Container-title:Journal of Microelectromechanical Systems
language:
Short-container-title:J. Microelectromech. Syst.

Author:

Falicov Ethan¹,Marvin Jessica²^ORCID,Ye Zhixin Alice³^ORCID,Almeida Sergio Fabian⁴,Contreras Daniel S.²,King Liu Tsu-Jae⁵,Spencer Matthew²^ORCID

Affiliation:

1. TrellisWare Technologies, San Diego, CA, USA

2. Department of Engineering, Harvey Mudd College, Claremont, CA, USA

3. Nvidia, Santa Clara, CA, USA

4. DiDi Labs, Mountain View, CA, USA

5. Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, CA, USA

Funder

Norman F. Sprague III M.D. Experiential Learning Fund

Rose Hills Foundation

Center for Energy Efficient Electronics Science

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

https://ieeexplore.ieee.org/ielam/84/9745978/9674756-aam.pdf

Reference60 articles.

1. Oxidation of tungsten and tungsten carbide in dry and humid atmospheres

2. Oxidation of Tungsten

3. Novel varistor material based on tungsten oxide

4. Metal contact reliability of RF MEMS switches

5. Adsorption of Oxygen and Carbon Monoxide on Tungsten

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Reprogrammable Mem Switch Utilizing Controlled Contact Welding;2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS);2023-01-15

2. Integrated 4-terminal single-contact nanoelectromechanical relays implemented in a silicon-on-insulator foundry process;Nanoscale;2023

3. Investigation of Electrical and Mechanical Reliability of Inkjet-Printed 4-Terminal Microelectromechanical Relays;Journal of Flexible and Printed Electronics;2022-12

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