S Parameters Optimization of High-Speed Differential Vias Model on A Multilayer PCB
Author:
Affiliation:
1. South China University of Teclmology,School of Microelectronics,Guangzhou,China
2. China Electronic Product Reliability and Environmental Testing Research Institute,Guangzhou,China
Funder
Research and Development
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873518.pdf?arnumber=9873518
Reference12 articles.
1. Impact of Via Stub Position on High Speed Serial Links
2. Simulation of Key Elements in 25Gbps Channel
3. Impact of Ground via Placement in Grounded Coplanar Waveguide Interconnects
4. A novel data pattern dependent electromagnetic emission modeling for high speed multi-channel interconnects
5. Analysis on Unintentional Resonances in High-Speed Signals from Non-Ideal Routing Stub
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