Author:
Ba Sa,Cao Qunsheng,Lian Zhifeng
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. S Parameters Optimization of High-Speed Differential Vias Model on A Multilayer PCB;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10