Author:
Kumar Vijender,Vasa Mallikarjun,Muthusamy Sukumar,Anand Gowri,Kumar Sanjay,Mutnury Bhyrav
Cited by
3 articles.
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1. Signal integrity aspect of High Speed Interface Routing in multilayered PCB environment;2023 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON);2023-12-11
2. S Parameters Optimization of High-Speed Differential Vias Model on A Multilayer PCB;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
3. Back-drilling of high-speed printed circuit boards: a review;The International Journal of Advanced Manufacturing Technology;2022-06-04