Embedded manifold cooling system for high performance computing ICs
Author:
Affiliation:
1. Laboratory of Microsystem Technology Institute of Microelectronics of the Chinese Academy of Science,Beijing,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873186.pdf?arnumber=9873186
Reference17 articles.
1. Planar-Radial Structured Thermoelectric Cooler for Local Hot Spot Cooling in Mobile Electronics
2. Microcontact-Enhanced Thermoelectric Cooling of Ultrahigh Heat Flux Hotspots
3. Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: A review
4. A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration
5. A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: An experimental study
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