Thermal-Mechanical Analysis of TSV Array in 2.5D Silicon Interposer-Reference-Cited by-同舟云学术

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Thermal-Mechanical Analysis of TSV Array in 2.5D Silicon Interposer

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Zou Bao¹,Ren Xingang¹,Cai Xueyuan²,Sun Guoxing³,Cui Yongxin¹,Huang Zhixiang³

Affiliation:

1. Key Laboratory of Target Recognition and Feature Extraction of Anhui Province,Lu’an,China

2. Anqing Normal University,School of Electronic Engineering and Intelligent Manufacturing,Anqing,China

3. Anhui University,Key Laboratory of Electromagnetic Environmental Sensing of Anhui Province,Hefei,China

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873475.pdf?arnumber=9873475

Reference9 articles.

1. Groove structure for stress releasing around TSV

2. Research of Wafer Level Bonding Process Based on Cu–Sn Eutectic

3. Thermal stress destruction analysis in low-k layer by via-last TSV structure

4. Fabrication and performances of a novel copper-ordered-reinforced polymer composite interposer

5. Simulation analysis of silicon through-hole thermal stress based on metal matrix composites;yang;Electronic Components & materials,2020

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of annealing residual stress on mobility of TSV vertical switch;IEICE Electronics Express;2024-05-25

2. Design of Miniaturized Silicon Based SiP TR Module;2023 3rd International Conference on Electrical Engineering and Control Science (IC2ECS);2023-12-29

3. Intelligent Multifield Collaborative Optimization Method for TSV Array With Performance Constraints;IEEE Transactions on Electron Devices;2023-09

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