Author:
Sun Han,Pi Yudan,Wang Wei,Chen Jing,Jin Yufeng
Cited by
2 articles.
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1. Thermal-Mechanical Analysis of TSV Array in 2.5D Silicon Interposer;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
2. A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs);IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-05