Microstructure coarsening of high-temperature Sn-Pb solder joint in IGBT modules of high-speed trains-Reference-Cited by-同舟云学术

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Microstructure coarsening of high-temperature Sn-Pb solder joint in IGBT modules of high-speed trains

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
language:
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Author:

Xue Sen-Ming¹,Zhou Shiqi²,Wang Xiaojing¹,Zeng Xiang-Hao³,Liu Zhi-Quan²

Affiliation:

1. Jiangsu University of Science and Technology,School of Materials Science and Engineering,Zhenjiang,China,212003

2. Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology,Shenzhen,China,518055

3. Zhuzhou CRRC Elect Times Co Ltd,Rail Transit R&D Center,Zhuzhou,China,412001

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873123.pdf?arnumber=9873123

Reference14 articles.

1. Constitutive models of creep for lead-free solders

2. A novel thermal-gradient creep test to evaluate the creep Behavior of Sn-Pb eutectic alloy

3. Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging

4. Effects of Ni addition on mechanical properties of Sn58Bi solder alloy during solid-state aging

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microstructure and Shear Properties Evolution of Minor Fe-Doped SAC/Cu Substrate Solder Joint under Isothermal Aging;Acta Metallurgica Sinica (English Letters);2024-04-15

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