A novel thermal-gradient creep test to evaluate the creep Behavior of Sn-Pb eutectic alloy-Reference-Cited by-同舟云学术

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A novel thermal-gradient creep test to evaluate the creep Behavior of Sn-Pb eutectic alloy

Published:2021-03-16 Issue:3 Volume:38 Page:139-146
ISSN:0960-3409
Container-title:Materials at High Temperatures
language:en
Short-container-title:Materials at High Temperatures

Author:

Zarhanesh Niloufar¹,Sameezadeh Mahmood¹^ORCID,Vaseghi Majid¹

Affiliation:

1. Department of Materials and Metallurgy, Faculty of Mechanical and Energy Engineering, Shahid Beheshti University, Tehran, Iran

Publisher

Informa UK Limited

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,Ceramics and Composites

Link

https://www.tandfonline.com/doi/pdf/10.1080/09603409.2021.1894313

Reference23 articles.

1. Small crack growth behaviors of a polycrystalline Ni- based superalloy under temperature gradient creep condition

2. An extensometer for creep-fatigue testing at elevated temperatures and low strain ranges (±0.2 per cent < δ∊ < 1.0 per cent)

3. Design of Extensometer for Creep Studies

4. A new design of uniaxial creep testpiece with slit extensometer ridges for improved accuracy of strain measurement

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1. High-reliability Sn37Pb/Sn58Bi composite solder joints by solid-liquid low-temperature soldering;Materials Today Communications;2024-12

2. Temperature-gradient and isothermal creep tests on 2024 aluminum alloy: A novel approach to creep failure evaluation aided by image processing;Engineering Failure Analysis;2024-08

3. Effect of Sb Content on the Microstructure and Mechanical Properties of Eutectic SnPb Solder;Materials;2024-05-09

4. Microstructure coarsening of high-temperature Sn-Pb solder joint in IGBT modules of high-speed trains;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

5. Creep rupture in carbon nanotube-based viscoplastic nanocomposites;International Journal of Plasticity;2022-03

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