Ductile-brittle transition during tensile tests of the general solder alloys at cryogenic temperatures-Reference-Cited by-同舟云学术

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Ductile-brittle transition during tensile tests of the general solder alloys at cryogenic temperatures

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Guo Xiaotong¹,Xie Fengjie¹,Zuo Xinlang²,Li Yong³,Tian Ruyu⁴,Liu Jiahao⁵,Wang Ganqiang⁶

Affiliation:

1. Chongqing CEPREI Industrial Technology Research Institute Co., Ltd,Chongqing,China,401332

2. China Electronic Product Reliability and Environmental Testing Research Institute,Guangzhou,China,510610

3. Chongqing CEPREI Industrial Technology Research Institute Co., Ltd,Chongqing,China

4. Yangzhou University,School of Mechanical Engineering,Yangzhou,China,225127

5. China Electronic Product Reliability and Environmental Testing Research Institute,Guangzhou,China,511370

6. Beijing CESI Technology Co., Ltd.,Beijing,China,100176

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873185.pdf?arnumber=9873185

Reference6 articles.

1. Influence of low temperature on tensile properties and fracture behavior of Sn3Ag0.5Cu solder alloy

2. Interfacial reactions and mechanical properties between Sn–4.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu–0.05Ni–0.01Ge lead-free solders with the Au/Ni/Cu substrate

3. Tensile deformation mechanism of Sn-37Pb solder alloy at cryogenic temperatures

4. Influence of interfacial intermetallic growth on the mechanical properties of Sn-37Pb solder joints under extreme temperature thermal shock;hang;Applied Sciences,2018

5. Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microstructural Evolution and Shear Properties Degradation of Tin-Lead/Copper Solder Joints at Cryogenic Temperatures;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

2. Microstructural Evolution and Deterioration of Shear Properties of Sn3.0Ag0.5Cu/Cu Solder Joints after Long-Term Storage at Cryogenic Temperatures;Crystals;2023-03-29

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