Microstructure Evolution and Failure Mechanism of Cu-based and Co-based Solder Joints under Thermoelectric Coupling Fields-Reference-Cited by-同舟云学术

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Microstructure Evolution and Failure Mechanism of Cu-based and Co-based Solder Joints under Thermoelectric Coupling Fields

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Chen Tao¹,Yang Donghua²,Chen Yuqian¹,Chang Jiwei¹,Wang Yuwei¹,Zhang Huanhuan¹,Xiang Weiguo¹

Affiliation:

1. Chongqing University of Technology,College of Materials Science and Engineering,Chongqing,China

2. Chongqing University of Technology,Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding, College of Materials and Technology,Chongqing,China

Funder

National Natural Science Foundation of China

Chongqing Municipal Education Commission

Chongqing University of Technology

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873103.pdf?arnumber=9873103

Reference8 articles.

1. Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

2. Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration

3. Effect of temperature on microstructural evolution of solder alloys under thermomigration

4. Microstructural, compositional and hardness evolutions of 96.5Sn–3Ag–0.5Cu/TiC composite solder under thermo-migration stressing

5. Interfacial reaction between Sn–Ag–Cu solder and Co–P films with various microstructures

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