Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration
Author:
Funder
Ministry of Trade, Industry and Energy
Korea Institute for Advancement of Technology
Publisher
The Korean Welding and Joining Society
Link
http://e-jwj.org/upload/jwj-39-1-89.pdf
Reference58 articles.
1. The Chip Bonding Technology on Flexible Substrate by Using Micro Lead-free Solder Bump
2. Micro-bump Joining Technology for 3 Dimensional Chip Stacking
3. Effect of Cu–Sn intermetallic compound reactions on the Kirkendall void growth characteristics in Cu/Sn/Cu microbumps
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