Effect of Cu–Sn intermetallic compound reactions on the Kirkendall void growth characteristics in Cu/Sn/Cu microbumps
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/53/i=5S3/a=05HA06/pdf
Reference25 articles.
1. Reduced impedance and superconductivity of SnAgCu solder alloy at high frequency
2. Fabrication of electroplate Sn-Ag bumps without a lithography process for 3D packaging
3. Measurement of adhesion and bonding strength studies in 3D interconnect structures using atomic force microscopy
4. Effects of the microstructure of copper through-silicon vias on their thermally induced linear elastic mechanical behavior
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