Modeling and characterization of copper interconnects for SoC design-Reference-Cited by-同舟云学术

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Modeling and characterization of copper interconnects for SoC design

Published:2003 Issue: Volume: Page:
ISSN:
Container-title:International Conference on Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003.
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Author:

Arora N.D.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/8729/27642/01233622.pdf?arnumber=1233622

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