Impact of Switching Variability, Memory Window, and Temperature on Vector Matrix Operations Using 65nm CMOS Integrated Hafnium Dioxide-based ReRAM Devices
Author:
Affiliation:
1. SUNY Polytechnic Institute,College of Nanoscale Science & Engineering,New York,USA
Funder
Air Force Research Laboratory
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9826869/9826902/09826924.pdf?arnumber=9826924
Reference16 articles.
1. A comprehensive review on emerging artificial neuromorphic devices
2. Nanoscale Hafnium Oxide RRAM Devices Exhibit Pulse Dependent Behavior and Multi-level Resistance Capability
3. Impact of Etch Process on Hafnium Dioxide Based Nanoscale RRAM Devices
4. Improving the Memory Window/Resistance Variability Trade-Off for 65nm CMOS Integrated HfO2 Based Nanoscale RRAM Devices
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1. Optimization of the position of TaOx:N-based barrier layer in TaOx RRAM devices;Frontiers in Materials;2024-06-03
2. Oxygen tracer diffusion in amorphous hafnia films for resistive memory;Materials Horizons;2024
3. Effect of Resistance variability in Vector Matrix Multiplication operations of 1T1R ReRAM crossbar arrays using an Embedded test platform;2023 IEEE 32nd Microelectronics Design & Test Symposium (MDTS);2023-05-08
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