Flux-assisted self-assembly with microbump bonding for 3D heterogeneous integration

Author:

Ito Yuka,Fukushima Takafumi,Lee Kang-Wook,Choki Koji,Tanaka Tetsu,Koyanagi Mitsumasa

Publisher

IEEE

Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Room-Temperature Cu Direct Bonding Technology Enabling 3D Integration with Micro-LEDs;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

2. Fundamentals of Solder Alloys in 3D Packaging;3D Microelectronic Packaging;2020-11-24

3. Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly;2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2020-04

4. Fundamentals of Solder Alloys in 3D Packaging;3D Microelectronic Packaging;2017

5. IC Packaging: 3D IC Technology and Methods;Lecture Notes in Electrical Engineering;2017

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