Fundamentals of Solder Alloys in 3D Packaging
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Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-319-44586-1_8
Reference45 articles.
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2. J.W. Peng, Y.S. Chen, Y. Chen et al., Removed organic solderability preservative (OSPs) by Ar/O2 microwave plasma to improve solder joint in thermal compression flip chip bonding. In 2014 I.E. 64th Electronic Components and Technology Conference (ECTC ), CPMT, Lake Buena Vista, FL, 27–30 May 2014, p 1584
3. L. Panchenko, K. Croes, I. De Wolf et al., Degradation of Cu6Sn5 intermetallic compound by pore formation in solid-liquid interdiffusion Cu/Sn microbump interconnects. Microelect. Eng. 117, 26–34 (2014)
4. C. Li, X. Wang, S. Song et al., 21-Layer 3-D chip stacking based on Cu-Sn bump bonding. IEEE Trans. Comp. Pack. Manu. Tech. 5(5), 627–633 (2013)
5. K.N. Tu, H.Y. Hsiao, C. Chen, Transition from flip chip solder joint to 3D IC microbump: its effect on microstructure anisotropy. Microelect. Rel. 53, 2–6 (2013)
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