Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration-Reference-Cited by-同舟云学术

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Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration

Published:2012-05 Issue: Volume: Page:
ISSN:
Container-title:2012 IEEE 62nd Electronic Components and Technology Conference
language:
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Author:

Lee Ching-Kuan,Zhan Chau-Jie,Lau John H.,Huang Yu-Jiau,Fu Huan-Chun,Huang Jui-Hsiung,Hsiao Zhi-Cheng,Chen Shang-Wei,Huang Shin-Yi,Fan Chia-Wen,Lin Yu-Min,Kao Kuo-Shu,Ko Cheng-Ta,Chen Tai-Hung,Lo Robert,Kao M. J.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6241679/6248788/06248898.pdf?arnumber=6248898

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Low-temperature, short-time, wafer-level bonding for Cu/Sn/Cu solid-state-diffusion interconnect in 3-D integration;Physica Scripta;2023-01-17

2. Inhibiting effects of the Ni barrier layer on the growth of porous Cu3Sn in 10-μm microbumps;Journal of Materials Science: Materials in Electronics;2021-06-24

3. Fundamentals of Solder Alloys in 3D Packaging;3D Microelectronic Packaging;2020-11-24

4. Fundamentals of Solder Alloys in 3D Packaging;3D Microelectronic Packaging;2017

5. Three-Dimensional and 2.5 Dimensional Interconnection Technology: State of the Art;Journal of Electronic Packaging;2014-02-18

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