Author:
Qiu Delong,Cao Liqiang,Wu Xiaomeng,Hou Fen gze,Zhang Jing,Wang Qidong
Cited by
2 articles.
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1. A junction temperature prediction model for 3D stacked packaging chip based on thermal resistance matrix;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. 3D photonics as enabling technology for deep 3D DRAM stacking;Proceedings of the International Symposium on Memory Systems;2019-09-30