Author:
Lu Hao,Takagi Yutaka,Suzuki Yuya,Sawyer Brett,Taylor Robin,Sundaram Venky,Tummala Rao
Cited by
14 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Panel level IC-package technology development;Microelectronics Reliability;2022-09
2. Cu Electrochemical Polishing for RDL Process of FOWLP and Effects of Cu Overburden Profiles;ECS Journal of Solid State Science and Technology;2022-02-28
3. Next-Generation Dry Film Photoresist for Advanced IC Substrate Applications;2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2021-12-21
4. Reliability of Fine-Pitch <5-μm-Diameter Microvias for High-Density Interconnects;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-09
5. Low-Loss Impedance-Matched Sub-25-μm Vias in 3-D Millimeter-Wave Packages;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-05