First Demonstration of Panel Glass Fan-Out (GFO) Packages for High I/O Density and High Frequency Multi-chip Integration-Reference-Cited by-同舟云学术

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First Demonstration of Panel Glass Fan-Out (GFO) Packages for High I/O Density and High Frequency Multi-chip Integration

Published:2017-05 Issue: Volume: Page:
ISSN:
Container-title:2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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Author:

Shi Tailong,Buch Chintan,Smet Vanessa,Sato Yoichiro,Parthier Lutz,Wei Frank,Lee Cody,Sundaram Venky,Tummala Rao

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7998598/7999654/07999669.pdf?arnumber=7999669

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Lock-in Thermography judgment for short/leakage/high resistance defects in advanced Fan-Out packages;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

2. RF Glass Technology Is Going Mainstream: Review and Future Applications;IEEE Journal of Microwaves;2023-04

3. Investigation on the reliability risk for high density Fan-Out packages;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07

4. Measure PI film topography by laser confocal microscope;Optical Measurement Systems for Industrial Inspection XII;2021-06-20

5. Process, Design and Simulation for Millimeter Wave Chip Packaging Using Embedded Glass Fan-Out Technology;2019 20th International Conference on Electronic Packaging Technology(ICEPT);2019-08

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