NCF for pre-applied process in higher density electronic package including 3D-package-Reference-Cited by-同舟云学术

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NCF for pre-applied process in higher density electronic package including 3D-package

Published:2012-05 Issue: Volume: Page:
ISSN:
Container-title:2012 IEEE 62nd Electronic Components and Technology Conference
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Author:

Honda Kazutaka,Nagai Akira,Satou Makoto,Hagiwara Shinsuke,Tuchida Satoru,Abe Hidenori

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6241679/6248788/06248859.pdf?arnumber=6248859

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bonding with Compression (LABC) for Bump Counts Exceeding 500,000 at a 20 μm Pitch;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Flip Chip Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024

3. Micro-structure analysis of solder joint using room temperature Laser-Assisted Bonding (LAB) process;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

4. Epoxy based Solder Paste for Flexible Substrate with Laser Assisted Bonding Process;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13

5. Assembly Process and Application Studies of Pre-Applied Underfill Non-Conductive Film (NCF) and Non-Conductive Paste (NCP) for Advanced Packages;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

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