Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bonding with Compression (LABC) for Bump Counts Exceeding 500,000 at a 20 μm Pitch-Reference-Cited by-同舟云学术

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Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bonding with Compression (LABC) for Bump Counts Exceeding 500,000 at a 20 μm Pitch

Published:2024-05-28 Issue: Volume: Page:943-948
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Choi Kwang-Seong¹,Joo Jiho¹,Choi Gwang-Mun¹,Shin Jungho¹,Lee Chanmi¹,Jang Ki-Seok¹,Oh Jin-Hyuk¹,Yun Ho-Gyeong¹,Moon Seok Hwan¹,Jung Ji Eun¹,Lee Gaeun¹,Eom Yong-Sung¹

Affiliation:

1. ETRI,Superintelligence Creative Laboratory,Daejeon,Korea

Funder

National Research Foundation of Korea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565251.pdf?arnumber=10565251

Reference13 articles.

1. Recent Advances and Trends in Advanced Packaging

2. A Study on the Advanced Chip to Wafer Stack for Better Thermal Dissipation of High Bandwidth Memory

3. NCF for pre-applied process in higher density electronic package including 3D-package

4. Understanding the Behavior of SnAg Bumps at 10 µm Pitch and Below for Imaging and Microdisplay Application

5. Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology

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