Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology-Reference-Cited by-同舟云学术

Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology

Published:2019-05 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Choi Kwang-Seong,Eom Yong-Sung,Moon Seok Hwan,Joo Jiho,Jeong leeseul,Lee Kwangjoo,Kim Jung Hak,Kim Ju hyeon,Yoon Gil-Sang,Lee Kwang-Hee,Lee Chul-Hee,Ahn Geun-Sik,Shim Moo-Sup

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8795274/8811008/08811272.pdf?arnumber=8811272

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Tailoring peel strength in UV-responsive, nonconductive adhesives via photocleavable epoxy for micro-LED bonding and repair;Materials Today Communications;2024-06

2. Reliability of Indium Solder Joints using a Laser-Assisted Bonding (LAB) Process at Room Temperature;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bonding with Compression (LABC) for Bump Counts Exceeding 500,000 at a 20 μm Pitch;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

4. Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. Micro-structure analysis of solder joint using room temperature Laser-Assisted Bonding (LAB) process;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05