3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer-Reference-Cited by-同舟云学术

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3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer

Published:2010-06 Issue: Volume: Page:
ISSN:
Container-title:2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)
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Author:

Topper Michael¹,Ndip Ivan¹,Erxleben Robert¹,Brusberg Lars¹,Nissen Nils¹,Schroder Henning¹,Yamamoto Hidefumi²,Todt Guido³,Reichl Herbert¹

Affiliation:

1. Fraunhofer Institute for Reliability and Microintegration (Fraunhofer IZM), Gustav-Meyer-Allee 25, 13355 Berlin/Germany

2. NEC SCHOTT Components Corporation 3-1 Nichiden, Minakuchicho, Koka-shi, Shiga 528-0034, Japan

3. SCHOTT Electronic Packaging GmbH Product Division Automotive, Landshut, Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5482824/5490635/05490887.pdf?arnumber=5490887

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3. Eco‐friendly glass wet etching for MEMS application: A review;Journal of the American Ceramic Society;2024-07-02

4. Modeling and Characterization of Annealing Effect on the Cu Protrusion and Thermomechanically Behaviors of Through Glass Via;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07

5. Development of Glass core substrate with the stress analysis, transmission characteristics and reliability;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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