The effect of boron anomaly on the dielectric properties and thermal expansion of barium borosilicate glasses for 3D packaging systems-Reference-Cited by-同舟云学术

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The effect of boron anomaly on the dielectric properties and thermal expansion of barium borosilicate glasses for 3D packaging systems

Published:2024-09 Issue:18 Volume:50 Page:32217-32224
ISSN:0272-8842
Container-title:Ceramics International
language:en
Short-container-title:Ceramics International

Author:

Liang Tianpeng^ORCID,Liu Yuan,Zheng Wei,Fu Haolun,Zhang Jihua,Chen Hongwei,Gao Libin,Chen Daming,Li Yuanxun

Funder

Fundamental Research Funds for the Central Universities

Publisher

Elsevier BV

Reference37 articles.

1. Trend from ICs to 3D ICs to 3D systems;Tummala,2009

2. TXV Technology: the cornerstone of 3D system-in-packaging;Zhao;Sci. China Technol. Sci.,2022

3. Interposer technologies for high-performance applications;Usman;IEEE Trans. Compon. Packag. Manuf. Technol.,2017

4. Fabricating Microstructures on Glass for Microfluidic Chips by Glass Molding Process;Wang,2018

5. 3-D Thin film interposer based on TGV (Through Glass Vias): an alternative to Si-interposer;Topper,2010

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