Fabrication of 3D-IC interposers-Reference-Cited by-同舟云学术

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Fabrication of 3D-IC interposers

Published:2013-05 Issue: Volume: Page:
ISSN:
Container-title:2013 IEEE 63rd Electronic Components and Technology Conference
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Short-container-title:

Author:

Keech John,Chaparala Satish,Shorey Aric,Piech Garrett,Pollard Scott

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6573226/6575533/06575825.pdf?arnumber=6575825

Cited by 17 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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3. Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching;Micromachines;2023-09-14

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