Approaches for a Solely Electroless Metallization of Through-Glass Vias
Author:
Affiliation:
1. Leibniz University Hanover,Institute of Micro Production Technology,Garbsen,Germany
2. Ulm University,DLR Institute of Quantum Technologies,Ulm,Germany
Funder
Ministry of Education
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816692.pdf?arnumber=9816692
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1. Electroless and Electrolytic Copper Plating of Glass Interposer Combined with Metal Oxide Adhesion Layer for Manufacturing 3D RF Devices
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3. Physical Sputtering and Sputter Deposition (Sputtering)
4. Enabling Logic with Backside Connectivity via n-TSVs and its Potential as a Scaling Booster;veloso,2021
5. Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications
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