Electroless silver plating on through-glass via (TGV) as an adhesive and conducting layer-Reference-Cited by-同舟云学术

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Electroless silver plating on through-glass via (TGV) as an adhesive and conducting layer

Published:2024-10 Issue: Volume:152 Page:106371
ISSN:1879-2391
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Huang Yuxuan^ORCID,Tao Zhihua,Cai Xudong,Long Zhiyuan,Lin Zewei,Li Wenlei,Fang Zhen,Wang Lingyue,He Siqi,Cai Xingzhou,Li Yong,Zhang Jihua

Publisher

Elsevier BV

Reference51 articles.

1. Fabrication, assembly and testing of a glass interposer-based 3D systems in package;El Amrani;Microelectron. Eng.,2016

2. Through glass VIAS using an industry compatible glass handling solution;Levy,2020

3. Resolving thermo-mechanically induced circumferential crack formation in copper through-glass vias;Okoro,2021

4. High-linearity RF interposers enabled by through glass vias;Shah;IEEE Microw. Wireless Compon. Lett.,2018

5. Progress and application of through glass via (TGV) technology;Shorey,2016

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