FC Cu pillar package development for broad market applications
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7133058/7159553/07159654.pdf?arnumber=7159654
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Cu/SnAg Pillar Bump Joints on Ni-Less Surface Finish in Laser Assisted Bonding (LAB);2024 International Conference on Electronics Packaging (ICEP);2024-04-17
2. Fine Copper Lines with High Adhesion on High Rigidity Dielectrics;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
3. Development and optimization of the laser-assisted bonding process for a flip chip package;Microsystem Technologies;2019-09-16
4. Numerical Analysis of Warpage Induced by Thermo-Compression Bonding Process of Cu Pillar Bump Flip Chip Package;T KOREAN SOC MEC ENG;2017
5. Ultra Fine Pitch / Low Cost FCCSP Package and Chip Package Interaction (CPI) for Advanced CMOS Nodes;2016 IEEE 66th Electronic Components and Technology Conference (ECTC);2016-05
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