Cu/SnAg Pillar Bump Joints on Ni-Less Surface Finish in Laser Assisted Bonding (LAB)-Reference-Cited by-同舟云学术

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Cu/SnAg Pillar Bump Joints on Ni-Less Surface Finish in Laser Assisted Bonding (LAB)

Published:2024-04-17 Issue: Volume:30 Page:85-86
ISSN:
Container-title:2024 International Conference on Electronics Packaging (ICEP)
language:
Short-container-title:

Author:

Han Sang Eun¹,Han Seonghui¹,Lee Tae-Young²,Lee Hoo-Jeong³,Yoo Sehoon¹

Affiliation:

1. Korea Institute of Industrial Technology (KITECH),Regional Industry Innovation Department (Growth engine),Incheon,Republic of Korea

2. School of Materials Science and Engineering, Tech University of Korea,Siheung,Korea

3. School of Materials Science and Engineering, Sungkyunkwan University,Suwon,Korea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10535428/10535429/10535432.pdf?arnumber=10535432

Reference6 articles.

1. High-end performance packaging: 3D/2.5D intergration 2020;Shoo;Market & Technology Report,2020

2. Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives

3. FC Cu pillar package development for broad market applications

4. High-Performance Flip Chip Bonding Mechanism Study with Laser Assisted Bonding

5. Reliable Nickel-Free Surface Finish Solution for High-Frequency, HDI PCB Applications

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