Mass Transport-Induced Failure of Hybrid Bonding-Based Integration for Advanced Image Sensor Applications-Reference-Cited by-同舟云学术

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Mass Transport-Induced Failure of Hybrid Bonding-Based Integration for Advanced Image Sensor Applications

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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Author:

Moreau Stephane,Bouchu David,Balan Viorel,Berrigo Anne-Lise Le,Jouve Amandine,Henrion Yann,Besset Carine,Scevola Daniel,Lhostis Sandrine,Guyader Francois,Deloffre Emilie,Mermoz Sebastien,Pruvost Julien

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545688.pdf?arnumber=7545688

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reliability of the hybrid bonding level using submicrometric bonding pads;Microelectronics Reliability;2023-11

2. Electromigration in three-dimensional integrated circuits;Applied Physics Reviews;2023-05-16

3. Recent Advances on Electromigration in Cu/SiO₂ to Cu/SiO₂ Hybrid Bonds for 3D Integrated Circuits;2023 IEEE International Reliability Physics Symposium (IRPS);2023-03

4. Correlation Between Electromigration-Related Void Volumes and Time-to-Failure by High Resolution X-Ray Tomography and Modeling;IEEE Electron Device Letters;2019-11

5. Robustness and reliability achievements for direct hybrid bonding integration: a review;2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D);2019-05

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