TGV (Thru-Glass Via) Metallization by Direct Cu Plating on Glass
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545595.pdf?arnumber=7545595
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Bendability Enhancement and Miniaturization of Through-X Via (TXV) Based on Flexible FOWLP with Tiny Cu Pillar Assembly;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Recent Progress of TGV Technology for High Performance Semiconductor Packaging;Journal of Welding and Joining;2024-04-30
3. TGV through-hole double-sided electroplated copper filling mode regulation and process reliability test study;SCIENTIA SINICA Chimica;2023-09-01
4. 75‐2: Failure Mechanisms and Optimum Methods for Through Glass Via;SID Symposium Digest of Technical Papers;2023-06
5. RF Glass Technology Is Going Mainstream: Review and Future Applications;IEEE Journal of Microwaves;2023-04
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