Affiliation:
1. Beijing BOE Sensor Technology Company, Ltd. Beijing China
Abstract
Due to high insulation, low dielectric loss and low cost, glass is considered as a promising substrate material for advanced package. Through glass via technology plays a key role in the 2.5D and 3D packaging. This paper analyzes failure mechanisms of TGV and discuss the optimum design and process.
Cited by
1 articles.
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