Author:
Kim Namhoon,Wu Daniel,Kim Dongwook,Rahman Arif,Wu Paul
Cited by
55 articles.
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1. Review of RF microsystem packaging process technology;Journal of Physics: Conference Series;2024-04-01
2. Present, Past, and Future of 3D Integration;Journal of The Japan Institute of Electronics Packaging;2024-03-01
3. Fabrication of high aspect ratio, non-line-of-sight vias in silicon carbide by a two-photon absorption method;Scientific Reports;2024-01-25
4. Thermal analysis of TSV with design factors;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
5. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023