Cryogenic Qubit Integration for Quantum Computing

Author:

Das R N.,Oliver W.D.,Yoder J.L.,Rosenberg D.,Kim D.K.,Yost D.,Mallek J.,Hover D.,Bolkhovsky V.,Kerman A.J.

Publisher

IEEE

Cited by 36 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Low-loss liquid metal interconnects for superconducting quantum circuits;Applied Physics Letters;2024-06-24

2. 3D interconnects for quantum computing;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Integration of planarized Nb-based vias to form a multi-level superconducting back-end-of-line;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

4. Fine pitch Nb-Nb Direct Bonding for quantum applications;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

5. Reworkable Superconducting Qubit Package for Quantum Computing;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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