Low-loss liquid metal interconnects for superconducting quantum circuits

Author:

Yao Zhancheng1ORCID,Sandberg Martin2ORCID,Abraham David W.2ORCID,Bishop David J.13456

Affiliation:

1. Division of Materials Science and Engineering, Boston University 1 , Boston, Massachusetts 02215, USA

2. IBM Quantum, IBM T.J. Watson Research Center 2 , Yorktown Heights, New York 10598, USA

3. Department of Electrical and Computer Engineering, Boston University 3 , Boston, Massachusetts 02215, USA

4. Department of Mechanical Engineering, Boston University 4 , Boston, Massachusetts 02215, USA

5. Department of Biomedical Engineering, Boston University 5 , Boston, Massachusetts 02215, USA

6. Department of Physics, Boston University 6 , Boston, Massachusetts 02215, USA

Abstract

Building a modular architecture with superconducting quantum computing chips is one of the means to achieve qubit scalability, allowing the screening, selection, replacement, and integration of individual qubit modules into large quantum systems. However, the nondestructive replacement of modules within a compact architecture remains a challenge. Liquid metals, specifically gallium alloys, can be alternatives to solid-state galvanic interconnects. This is motivated by their self-healing, self-aligning, and other desirable fluidic properties, potentially enabling the nondestructive replacement of modules at room temperatures, even after operating the entire system at millikelvin regimes. In this study, we present coplanar waveguide resonators (CPWRs) interconnected by gallium alloy droplets, achieving high internal quality factors up to nearly one million and demonstrating performance on par with the continuous solid-state CPWRs. Leveraging the desirable fluidic properties of gallium alloys at room temperature and their compact design, we envision a modular quantum system enabled by liquid metals.

Funder

IBM Research

Publisher

AIP Publishing

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