Mechanical properties of Sn-Bi bumps on flexible substrate
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/6573226/6575533/06575692.pdf?arnumber=6575692
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Eutectic Bonding in Sequential Bi and Sn Layers for Low-Temperature Interconnections;2024 International Conference on Electronics Packaging (ICEP);2024-04-17
2. Sn–Bi–Ag Solder Enriched with Ta2O5 Nanoparticles for Flexible Mini-LED Microelectronic Packaging;ACS Applied Nano Materials;2024-01-09
3. Identification of Solder Joint Failure Modes Using Machine Learning;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-12
4. A Review of Low-Temperature Solders in Microelectronics Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-04
5. Finite Element Analysis for Safe Design of a Flexible Microelectronic System under Bending Deformation;ECS Journal of Solid State Science and Technology;2022-04-01
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