Eutectic Bonding in Sequential Bi and Sn Layers for Low-Temperature Interconnections
Author:
Affiliation:
1. University of Seoul,Department of Materials Science and Engineering,Seoul,Rep. of Korea,02504
Funder
Ministry of Trade, Industry & Energy (MI)
Korea Evaluation Institute of Industrial Technology (KEIT)
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10535428/10535429/10535706.pdf?arnumber=10535706
Reference6 articles.
1. Fine Pitch Bumping and Flip Chip Joining with Sn-Bi Based Solders by Injection Molded Solder Technology
2. Mechanical properties of Sn-Bi bumps on flexible substrate
3. Low thermal budget bonding for 3D-package by collapse-free hybrid solder
4. Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties
5. Ultrasonic dispersion of nanocomposite solder for microelectronic packaging
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