Warpage Analysis with Newly Molding Material of Fan-Out Panel Level Packaging and the Board Level Reliability Test Results
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8415930/8429093/08429662.pdf?arnumber=8429662
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Simulation modeling of 600mm X600mm fan-out panel level for warpage behavior based on chip first;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
2. Simulation Modeling of 600mm X600mm Fan-Out Panel Level for Warpage Behavior Based on Chip First;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25
3. A comparative analysis of printed circuit drying methods for the reliability of assembly process;Microelectronics Reliability;2022-02
4. Failure Analysis and Stress Evaluation of Maleimide Molding Films during Temperature Cycling;Transactions of The Japan Institute of Electronics Packaging;2021
5. Maleimide Resin Blends with Enhanced Toughness for High-Temperature Semiconductor Packaging;Transactions of The Japan Institute of Electronics Packaging;2021
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